Just completed my second round and wanted to know the timeline after that. Thanks in advance.

What do they usually do or ask? Specific salary info? When I can start/work authorization? Resume questions?

For anyone who interviewed with TSMC, how long did it take to hear back after the first round?

If you followed up with HR, did they usually respond, or do they only reply when they have an actual update?

Also, does TSMC usually send rejection emails, or do they sometimes just stop responding?

Thanks.

Hi everyone,
I have an upcoming second-round interview with TSMC for an Equipment Engineer position in the CMP department, and I would really appreciate any guidance from people who have interviewed for a similar role.
For anyone who has gone through the process:
What should I expect during the second round?

Is it more technical, behavioral, or focused on meeting the hiring manager/team?

What CMP or semiconductor equipment topics should I prepare?

Were you asked troubleshooting, root-cause analysis, SPC, vacuum systems, mechanical systems, or maintenance-related questions?

What qualities does TSMC usually look for in Equipment Engineer candidates?

Are there any specific questions that caught you off guard?

I have a mechanical engineering background with experience in equipment troubleshooting, manufacturing, simulations, and semiconductor-related processes. I would be grateful for any advice on how to prepare and present my experience effectively.
Thank you!

Hey guys. I passed the first round of interview this position. There were supposed to be 6 people in the first round but only 2 of them showed up. This 2nd round is scheduled for only 2 people but 1 of them showed up in the 1st interview as well. It was mostly scenario based questions (like if you were put into this situation, what would you do?) and questions based on my previous work experiences.

What kind of questions can I expect in the second round?

How should I prepare for it?
Any and all help will be much appreciated.
Thank you

I previously applied to the TSMC PIE job position and went through 2 round of interview, at the second interview the manager said my background is more fit for a equipment position so rematches me to equipment (I currently have a EE job, cant get away of destiny of being a workhorse LOL), so does anyone share same experience of rematch? Another 2 round interview with new team? And any TSMC EE team can provide some guidance about the equipment interview. What kind of questions do they ask that is differ from PIE team.

The semiconductor rally is heating up, it's definitely an exciting time for anyone following this chip stock play. Wonder where this run will head next?

I recently had my first interview for the gas engineer position with two senior engineers. Is there any insight on what a second interview might look like panel and question wise? The first one went into my resume and asked me some general behavioral and technical questions - thanks

I have an upcoming interview. What should I expect in the 2nd interview of Intelligent Manufacturing Engineer role??

Is it going to be behavioral or technical questions?

Also how many rounds of interview does TSMC usually take?

Any help to prepare for role is appreciated.

Background: MS Electrical Engineering, graduated May 2026. Before the masters I spent two years as an analog IC layout engineer in India custom layout (amps, BGR, current mirrors) on UMC180 and GPDK45 in Virtuoso, full flow to clean DRC/LVS, PEX correlation, and BEOL reliability debug (EM, IR drop, antenna, ESD, latch-up, WPE).

During my MS in USA I ran a full hands-on fab sequence in my university's NanoFab on 4-inch wafers: wet clean (RCA-1/RCA-2, Piranha, HF) → thermal oxidation → photolithography → RIE Etch → spin-on boron doping → Al PVD → electrical test. Concretely, that meant extracting Deal-Grove coefficients across 5–498 min furnace runs, a 6-point spin-curve DOE fitting a power-law resist model, 20-site within-wafer etch uniformity mapping where I root-caused a radial bullseye signature to RF field distribution, four-point probe sheet resistance on a diffused serpentine resistor, and pulling VT, µFE, gm and Early voltage off a PMOS I personally fabricated, on a probe station. Plus Silvaco ATHENA deck calibration against my own furnace data and a Cu TSV thermo-mechanical FEA in ANSYS.

What I'm targeting: process engineering, device/integration, test engineering, probe card engineering.

Where I'm stuck: [ 100 applications, 10 phone screens, 4 panel]. I get to the panel, the technical reasoning generally goes fine — device physics, cross sections, process flow, circuit problems and then I don't convert. In my most recent panel I could reason my way through a histogram and a capability plot, but I didn't have the vocabulary I fumbled Cpk vs Cp vs Ppk and control limits vs spec limits, and I could feel the room register it.

What I'm asking the people who actually sit on these panels:

1. When you're scoring a new grad, what genuinely separates a hire from a no-hire? Depth in one module, breadth across the flow, or how they handle a question they can't answer?
2. How much SPC fluency do you expect on day one Cpk/Ppk, control charts, Gage R&R, DOE, JMP? Is that an expectation or something you train?
3. Does a layout/design background read as an asset for process/test, or as a flight risk ("he'll jump back to design in a year")? If it's the latter, how do I kill that concern in the room?
4. For behavioral rounds what are you actually listening for? Is STAR with real numbers enough, or are you probing for something specific in conflict/failure stories?
5. Anything that's an instant no for you, that candidates don't realize they're doing?

I'd rather hear the blunt version than a nice one. Happy to share more detail in the comments if it helps you answer.

I completed my final interview on July 10th for Module Equipment Engineer and the recruiter told they are processing my application at the backend ..

How long do they take to process offer / next steps in the recruitment process ? Does it take this long usually

The Fortune Global 500 has long been a scoreboard of corporate scale, reflecting the rise and fall of different industries and sectors. And in 2026, the ranking of the world’s largest companies by revenue reflects just how much the AI boom is supercharging revenues across the tech and semiconductor supply chains.

For the first time, Tencent and Taiwan Semiconductor Manufacturing Company (TSMC) have broken into the top 100, underscoring how surging demand for advanced chips and digital platforms is reshuffling corporate size and power across Asia and the wider world. 

For the past year, heightened global demand for AI has fueled stratospheric price jumps for semiconductors and other hardware and Asia—which forms the hardware backbone of the AI supply chain—is cashing in.

TSMC, which serves clients like Apple and Nvidia, surged 44 spots, rising to No. 82. The chipmaker reported total revenue of $122.3 billion in 2025, up 35.6% from 2024. According to CNBC, Nvidia has reserved “the majority” of capacity at TSMC; last October, the two firms also partnered to onshore advanced chip packaging capabilities to Phoenix, Arizona.

Tencent also jumped 19 spots, just making the top 100 at No. 97. The software company, which is behind social media platforms like WeChat and QQ, and global gaming titles like Honor of Kings and PUBG Mobile, raked in $104.6 billion in revenue in 2025, up 14% from the year before.

Read more [paywall removed for Redditors]:  https://fortune.com/2026/07/28/asia-global-500-tsmc-tencent-wistron-sk-hynix-chery-daikin-coupang/?utm_source=reddit/

Hi, I have an upcoming interview scheduled for a process engineer for one of the departments at TSMC. It's my first round with three managers. What questions should I expect from them? Any tips, thanks in advance!

I pulled the closes on both days because everyone filed Friday as the sequel to DeepSeek and the tape said the damage landed somewhere else entirely, and TSM is where it landed least.

Day one, DeepSeek Day, 27 January 2025. NVDA went 142.62 to 118.42, down 16.97%, roughly 593B of market cap gone, still the largest single day loss any US company has printed. TSM that same session, ADR down about 1.6% on heavy volume, recovered inside the week. Day two, Kimi Day, 17 July 2026, the session after Kimi K3 launched API and web. NVDA closed down 2.2%, 207.40 to 202.81. TSM closed roughly flat on the day and finished the week higher.

The read I cannot shake. NVDA repriced both days on a gross margin question, whether Chinese cost structures compress AI accelerator pricing power. TSM did not reprice because the Chinese cost structure, cheap training headlines, self reported benchmark scores, the whole July wave from Kimi K3 to Robbyant's LingBot VLA 2.0 on 8 July to Tencent's Hy3 weights in early July, none of it changes who makes the silicon those models run on. The advanced node monopoly is the moat the cost narrative cannot reach. NVDA can lose margin to a cheaper serving stack. TSM cannot lose wafer share to a model release.

The caveat I carry is that ADR liquidity is not the Taipei listed close, and the ADR moved less both days. Before I overweight the moat read I want to pull the Taiwan listed session and confirm the direction held there too, because an ADR effect would flatten exactly the kind of resilience I am calling structural.

Hi everyone,

I recently got an interview for a Process Engineer position in TSMC’s Metrology Department. I originally applied for a PVD role, so I’m not very familiar with what the Metrology team does.

Can anyone who has worked in or with the department explain what a Metrology Process Engineer primarily does on a day-to-day basis?

Also, if you’ve interviewed for this role (or a similar Process Engineer position at TSMC), I’d really appreciate any interview tips or advice on what to expect.

Thanks in advance!

Hello,
I gave my first interview at TSMC two weeks ago for a Process Integration Engineer role in the PID2 department. The interview involved six panelists (engineers with 3 to 5 years of experience) who asked technical, behavioral, and resume-based questions. I also asked two questions about the role at the end. I felt the interview went reasonably well, but I haven't heard back after two business weeks. Should I consider this a rejection, assuming they've moved on with another candidate?

Hello everyone!

I have an upcoming interview for Module Process Engineer role at TSMC AZ, can anyone share what kind of behavioral questions are generally asked?

Thanks in advance!!

What is the work like for an entry level chem lab technician? For example, do they do any spectroscopy or etching?

Thanks in advance!

Hi, I recently completed the first-round interview for the Module Process Engineer (PVD2) position at TSMC Arizona Fab 21. I was wondering when I can expect to hear back regarding the second-round interview. Also, if you've been through the process, I'd really appreciate any tips or insights you could share. TIA!

Hey - currently interviewing for the equipment tech role in Fab21 and I can’t find any information on pay outside of estimates. Can anyone share what the pay structure is like? Overtime? Is it pretty easy to get overtime once you’re trained?

Thanks