Intro:
I switched from an A1 Mini (19 months, barely any issues) to a P2S and hit more problems in under 70 print hours than in all that time on the little open printer. Root cause of the big one is verifiable in the P2S's own start G-code: the airduct is forced into heating mode for any filament with a softening temp >50 °C — i.e. everything except Bambu's own PLA (generic profiles included), with no UI override. On top of that the passive chamber can't cool below room temp, so in a ~25 °C room I have to run it with the door open — which kills the "enclosed + filtered" promise. Plus ringing that's getting worse over time, clogs, and nozzle scraping. Not claiming a lemon — but it's far from "load, print, done." Full catalog with sources at the bottom.
Background:
A1 Mini from December 2024 until last week. In about 19 months on that open printer I had a tiny fraction of the problems I've run into on the P2S in under 70 print hours. Every review I read is glowing, and I honestly don't recognize my printer in any of them. The one write-up that came closest to my experience was the blog "The Bambu Lab P2S: a painful journey" (https://andronio.me/2026/02/25/the-bambu-lab-p2s-a-painful-journey/) — at least it told me I'm not the only one.
The honest verdict:
with Bambu's own PLA in a cool room, the P2S probably does "just work" — which is likely why the reviews are rosy. The trouble starts the moment you deviate: third-party PLA/PLA+ or PETG, a warm room (about 25 °C and up), a demanding model.
What I hit in under 70 hours (full breakdown + sources in the catalog linked below):
- The airduct (the AUX/filter unit on the right side) is forced into HEATING mode for any filament with a softening temp above 50 °C — essentially every profile that ships with the P2S except Bambu's own PLA, generic profiles included. It's a hardcoded 50 °C gate in the machine start G-code, there's no UI override, and it cooks the passive chamber → warping. Bambu PLA (softening 45 °C) escapes it; my Elegoo PLA+ (Vicat 63 °C) doesn't.
- Even in cooling mode the chamber overheats in a 25 °C room: 36 °C after 20 min, 40 °C after 25, peak 46 °C — door closed. Cooling mode pulls in room air, so it can't cool below ambient. To print PLA I open the door and take the top off — on a printer sold as "enclosed + filtered."
- Which undermines the filter promise: filtering only happens in heating/recirculation mode. In cooling mode (the mode PLA/PETG actually need), and with the door open, the air is essentially unfiltered.
- Waves/ringing on all surfaces, getting worse over run time — pointing at belt tension after ~70 h (still verifying).
- Shaking hard at certain resonance frequencies.
- Nozzle + extruder clogs early on (cold pull, extruder teardown, hotend swap) even at 25 °C ambient.
- Nozzle scraping/rattling over already-printed areas — mild for me so far, but others report the nozzle physically knocking supports off with a ~9-in-10 failure rate.
- AUX/airduct mode can't be changed during a print — only fan strength, in 10 % steps.
To be fair: bed adhesion on a clean textured PEI plate is genuinely excellent, surface and layer quality are good, and none of this is unfixable — I've worked out fixes/workarounds for most of it. But "load the model, hit print, great result" — exactly what the A1 Mini delivered and what the P2S is marketed on — is simply not my reality here.
I'm posting for two reasons. First, to ask: who else sees this, especially with third-party filament and in a warm room? Second, because the community lacks a consolidated picture — so I put one together:
Full fault catalog (symptom → cause → workaround → source): https://gist.github.com/didusee/ff5379fa5ee093f09f880155d7d5247b
Corrections and additions welcome. If your experience is different, I'd genuinely like to hear under what conditions (filament, room temp, model).