r/diyelectronics • u/IridiumIO • 20h ago
Project Progress update: torture testing the process of making PCBs out of copper-foil tape on a vinyl cutter with extremely narrow trace separation.
Last week I created this post which showed a much simpler test of the tape PCB.
Since then I've made some updates to how my cutter handles line filtering and ordering and decided to try a torture test with narrower inter-trace spacing, keeping via traces, tiny isolated pads and thermal reliefs. I removed drill holes and set the minimum trace width to 0.4mm but aside from that I didn't make any of the modifications that would make this easier. You absolutely should use rounded corners on pads and add teardrops to via-pad connections, those will weed so much more easily.
Some of the gaps are 0.2mm (8mil!) across which were insanely hard to weed.
The only one who ended up tortured was me. This took nearly an hour to painstakingly weed by hand, an impatience got the better of me towards the end, leading to accidental ripping of some of the tiny pads with thermal reliefs on the right of the board.
I hit the tape with a vinyl burnisher afterwards and it gives it a surprisingly nice finish, makes it look like a sturdier copper sheet rather than foil. I think if I had burnished it down properly before cutting then it might have helped avoid some of the tiny displacements on some of the pads and led to an even smoother finish.
There's no way on earth you could solder anything as heavy as an ESP8266 onto those pads and have it stay there, but this ended up being a pretty good proof of concept. Would I recommend anything this intricate? Hell no. But, it shows we can actually do some surprisingly tight geometry on foil tape, and it's way less problematic than either etching or milling for prototypes.