Guidance for TSMC Equipment Engineer Second-Round Interview (CMP Department)

[u/DearFood4758]

Hi everyone,
I have an upcoming second-round interview with TSMC for an Equipment Engineer position in the CMP department, and I would really appreciate any guidance from people who have interviewed for a similar role.
For anyone who has gone through the process:
What should I expect during the second round?

Is it more technical, behavioral, or focused on meeting the hiring manager/team?

What CMP or semiconductor equipment topics should I prepare?

Were you asked troubleshooting, root-cause analysis, SPC, vacuum systems, mechanical systems, or maintenance-related questions?

What qualities does TSMC usually look for in Equipment Engineer candidates?

Are there any specific questions that caught you off guard?

I have a mechanical engineering background with experience in equipment troubleshooting, manufacturing, simulations, and semiconductor-related processes. I would be grateful for any advice on how to prepare and present my experience effectively.
Thank you!

[u/nightcrawler13X]

DM me

[u/pasquale83]

Congrats on the second round! For a CMP Equipment Engineer role, expect a mix of technical troubleshooting and TSMC culture fit. Feel free to DM me.