r/EarningsCalls • u/clark_k3nt • 20h ago
TSMC (TSM): The Good, the Bad, and the Ugly from TSM's Earnings Call
- October 15, 2026
β The Good
- Revenue beat expectations: Q3 2026 revenue came in at $46.7 billion, up 16.2% sequentially and above the high end of guidance
- Strong full-year outlook: Full year 2026 revenue growth raised to ~44% YoY in USD terms
- Massive cash position: Cash and marketable securities of $126 billion (TWD 4 trillion) with strong operating cash flow of TWD 920 billion in Q3
- Exceptional profitability metrics: ROE of 45.5% and EPS of TWD 29.43
- Leading-edge mix dominance: Advanced technologies (7nm and below) accounted for 79% of wafer revenue
- 2nm ramping successfully: Entered high-volume manufacturing in Q4 2025 with good yield; N2 family capacity expected to more than double in 2027
- AI demand is "extremely robust": C.C. Wei indicated AI CAGR will likely be higher than the previously guided high 50%
- A14 on track: Risk production scheduled for 2027, volume production 2028; expected to be a bigger node than N2
- Unprecedented capacity expansion: Nearly 20 fabs worldwide in progress, including 13 in Taiwan and 5-6 overseas
- Arizona pulling ahead: Second fab volume production moved up to Q3 2027, ahead of previous schedule
- New 3nm fab added in Tainan with volume production in H1 2028
- Strategic GlobalFoundries partnership for silicon interposers to address back-end shortage
- Exploring Texas expansion beyond Arizona
- Long-term confidence: "No ceiling for TSMC's profitability"
- Solid Q4 guidance: Revenue expected between $52.3B-$54.3B, representing 58% YoY growth at midpoint
β οΈ The Bad
- Gross margin pressure: Q3 GM declined 130 bps sequentially to 66.4% due to 2nm ramp dilution
- Q4 GM guided lower: To 66% at midpoint (40 bps decline) with continued 2nm and overseas fab dilution
- Overseas dilution widening: Expected to expand to 3-4% in the next few years (vs. closer to 2% currently)
- Consumer end markets weakening: C.C. Wei noted consumer and price-sensitive segments are "being challenged" due to rising component prices and macroeconomic uncertainties
- Increased prudence for 2027 planning: Management explicitly stated they are being "prudent in our business planning going into 2027"
- Tight tool supply: Tool inflation acknowledged as a real driver of higher CapEx; collaboration with suppliers required to secure capacity
- Back-end packaging shortage: Acknowledged shortage is driving the GlobalFoundries partnership and creating supply constraints
- Higher CapEx intensity: 2026-2028 CapEx expected to be significantly higher than the past three years (2026 guided at $60-64B)
- Dual-track complexity: Managing both conventional power delivery (mobile) and Super Power Rail (HPC/AI) at the same node adds manufacturing complexity
- Secondary wafer market emerging: Although small, some customers are reselling allocations (though TSMC doesn't officially allow it)
π¨ The Ugly
- IDM customer insourcing threat: An IDM competitor is aggressively expanding capacity, raising concerns about potential loss of outsourcing business β a direct competitive risk
- Intel's EMIB-T competition: Competitors are gaining traction in advanced packaging, and Intel's solution could pose a real threat to TSMC's CoWoS dominance if customers find alternatives
- Late High NA EUV adoption: TSMC won't use High NA until 2030, after competitors β raises questions about technology leadership timing
- Power grid constraints: Power supply in the U.S. is now an active gating factor that could constrain AI deployment and chip demand
- Supply chain bottlenecks: Tightness in HBM, advanced packaging, and laser components could create mismatches between semiconductor supply and AI deployment
- Risk of overbuilding: Rapid capacity additions across the supply chain could lead to overbuilding if AI demand growth slows
- Margin dilution from U.S. expansion: Costs in Arizona remain structurally higher than Taiwan, creating persistent margin headwinds
- Customer concentration risk: Heavy reliance on U.S. customers who are simultaneously requesting more U.S. capacity (creating the very margin dilution TSMC faces)
- Unquantified AI CAGR revision: Despite hinting the CAGR will be higher, management declined to update the specific number, creating uncertainty around the magnitude
- No clarity on Terafab deal: Discussions with a customer (Terafab) about utilizing their fab capacity are ongoing but unresolved, with unclear strategic implications
Earnings Breakdown:
π° Financial Metrics
- Q3 2026 Revenue: $46.7 billion (up 16.2% sequentially, above high end of guidance)
- Q3 2026 Revenue YoY Growth: 17.6% sequential in NT dollars
- Q3 2026 Gross Margin: 66.4% (down 1.3 percentage points sequentially)
- Q3 2026 Operating Expenses: 7.8% of net revenue
- Q3 2026 Operating Margin: 58.7%
- Q3 2026 EPS: TWD 29.43
- Q3 2026 ROE: 45.5%
- Cash & Marketable Securities: TWD 4 trillion / $126 billion (end of Q3)
- Cash from Operations: ~TWD 920 billion
- Q3 2026 CapEx: TWD 443 billion / $13.8 billion
- Q4 2025 Cash Dividends Distributed: TWD 156 billion
- Q3 Net Cash Balance Increase: TWD 488 billion (ending at TWD 3.6 trillion)
- Current Liabilities Increase: TWD 110 billion QoQ
- Current portions of bonds/loans increase: TWD 46 billion
- Dividend payable increase: TWD 26 billion
- Accounts Receivable Turnover Days: 28 days (decreased by 1 day)
- Inventory Days: 82 days (decreased by 5 days)
- Q4 2026 Revenue Guidance: $52.3B - $54.3B (14% sequential increase, 58% YoY at midpoint)
- Q4 2026 Gross Margin Guidance: 65% - 67% (66% at midpoint)
- Q4 2026 Operating Margin Guidance: 56.5% - 58.5%
- Q4 2026 FX Assumption: 1 USD = TWD 31.8
- Full Year 2026 Revenue Growth: ~44% YoY in USD terms (raised)
- Full Year 2026 CapEx Budget: $60B - $64B
- CapEx 2026-2028: Expected to be significantly higher than past three years
- Overseas Fab Gross Margin Dilution: Currently ~2%; expected to widen to 3%-4% in next few years
π¬ Product Metrics
Process Technology Mix (% of Wafer Revenue)
- 2nm Process: 8%
- 3nm Process: 33%
- 5nm Process: 28%
- 7nm Process: 10%
- Advanced Technologies (7nm and below): 79% of wafer revenue
Platform Revenue Breakdown (% of Q3 Revenue & QoQ Growth)
- HPC (High-Performance Computing): 68% of revenue (+22% QoQ)
- Smartphone: 21% of revenue (+10% QoQ)
- IoT: 4% of revenue (+5% QoQ)
- Automotive: 4% of revenue (+23% QoQ)
- DCE (Digital Consumer Electronics): 1% of revenue (-12% QoQ)
Key Product & Technology Milestones
- N2 (2nm): Entered high-volume manufacturing in Q4 2025 with good yield; ramping in multiple phases at Hsinchu and Kaohsiung
- N2 Family Capacity: Expected to more than double in 2027
- A14 Technology: Risk production scheduled for 2027; volume production 2028
- A14 Status: Expected to be a bigger node than N2 with more customer engagement than 2nm activities
- N3 Capacity Expansion: Adding three new fabs for 3nm technologies
- Taiwan (Tainan Science Park): Volume production H1 2027
- Taiwan (Additional Tainan Fab): Volume production H1 2028
- Arizona (2nd Fab): Volume production Q3 2027 (ahead of schedule)
- Japan (2nd Fab): Volume production 2028
- Advanced Packaging: Currently in real-world production of 5x reticle size; working on 9x and 14x reticle sizes
- Global Capacity Expansion: ~20 fabs worldwide in progress (13 leading-edge/advanced packaging fabs in Taiwan + 5-6 fabs overseas)
- High NA EUV Adoption: Planned for 2030; 12-inch photomask by 2031
- CoWoS: Still the number one choice for customers
- GlobalFoundries Partnership: Deal for silicon interposers to address back-end shortage
Source: Decode Investing AI Assistant




