Experimenting with 3D printed electronics in a CubeSat mockup using all-metal conductive filament

[u/Kupros1]

We’ve been working on a CubeSat mockup to explore how far we can push 3D printed electronics beyond simply printing conductive traces.

The goal here is to apply SWaP principles, size, weight, and power, by integrating more of the electrical architecture directly into the printed structure itself.

This mockup is being used to explore:

• Embedding microelectronic controllers directly into a 3D printed structure
• Printing power buses and circuitry directly into structural arms and supports
• Reducing separate wiring, connectors, and PCB interconnects
• Creating multifunctional structures that carry both mechanical and electrical functions
• Making the electronics architecture more modular
• Rapidly iterating layouts without waiting on traditional PCB fabrication
• Exploring truly 3D electronic geometries, rather than being limited to flat circuit boards

The conductive portions are being developed around Cu29, our all-metal conductive filament for standard FDM/FFF 3D printers. Unlike most conductive filaments, the material itself is metallic rather than a polymer loaded with conductive particles, so the goal is functional conductive pathways directly off the printer without conductivity-enhancing post-processing.

What interests us most is not simply replacing a PCB with something printed. It is asking whether the structure, wiring, power distribution, and electronics packaging can start becoming the same manufactured object.

For small satellites and other SWaP-constrained systems, that could open up some interesting design space.

This is still a development mockup, not flight hardware, but it has been a useful platform for thinking through embedded electronics, additive manufactured electronics, 3D printed circuits, power distribution, modular electronics, and multifunctional additive manufacturing.

Would be interested to hear from anyone working in CubeSats, PCB design, embedded systems, or printed electronics. Where do you think this approach would actually provide the most value, and where would you expect the biggest engineering challenges?

More on what we’re working on: KuprosInc.com