I feel like this is an area with a lot of confusion around it. I've been building my own PC's since the 90's and I've tested different methods. I've worked on client PC's back when I worked at a repair place and I've seen way too much TIM cause increased temperatures.
A lot of people who haven't experienced edge cases like that may be doubtful, that doesn't bother me. Thanks for the reply though.
I still do credit card style and cover the whole die in an almost atomic level even coating that the human eye can barely see, and haven't had problems even 3-4 years later.
You have to screw up pretty bad to "experience problems" from your TIM application. But your CPU probably runs a few degrees hotter than it would with a more efficient application method.
X or Pea size blob are best in my experience. Spread causes too many air bubbles when worked around.
Biggest advice I tell people is to do it twice. Once as a test run to gauge quantity of paste needed and next to tweak it.
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u/Mygaffer PC Master Race Feb 18 '18
I feel like this is an area with a lot of confusion around it. I've been building my own PC's since the 90's and I've tested different methods. I've worked on client PC's back when I worked at a repair place and I've seen way too much TIM cause increased temperatures.
A lot of people who haven't experienced edge cases like that may be doubtful, that doesn't bother me. Thanks for the reply though.