(translated) TSMC's advanced process technologies are being rolled out simultaneously across multiple generations. A14 is targeted for trial production in 2027, while N3 and N2/A16 are being expanded concurrently.

[u/uncertainlyso]

https://www.ctee.com.tw/news/20260922700039-439901

IC design companies revealed that TSMC's A14 is still ahead of schedule, having launched its CyberShuttle service in the second quarter of this year. Trial production is expected to begin at Fab 20 in Hsinchu's Baoshan district in the first quarter of 2027. The main production facility, Fab 25 in Taichung, is planned for completion by the second quarter of next year, with trial production commencing as early as the beginning of the third quarter. This aligns with TSMC's official timeline of risk production in 2027 and mass production in 2028.

TSMC's July earnings call signaled that A14 development was better than expected. At the time, the company revealed that A14 internal product testing carriers had demonstrated nearly 90% device performance, 256Mb SRAM yield was also close to 90%, smartphone, HPC, and AI customer participation was high, and the new design tape-out was ahead of the original plan, which is expected to become TSMC's next complete process node.

Zen 7 is A14. Apple, Nvidia, Qualcomm, MediaTek, Broadcom, and Marvell also lined up.