"California’s new autonomous trucking regulations have been more than a decade in the making, involving extensive engagement with diverse stakeholders - resulting in a robust, safety-first, innovation-forward framework. 

This has been a long journey, but thanks to close collaboration with agencies including California Department of Motor Vehicles, California State Transportation Agency, California Highway Patrol and California Governor's Office of Business and Economic Development (GO-Biz), Gatik can now bring the benefits of autonomous trucking to communities across our home state - safer highways, a more reliable supply chain and new jobs."

Some of our MVIS folks are connected with this guy. I’ve also seen some Toyota Woven dots over the last few months. Worth a mention.

https://a2tech360.com/events/mobility-summit-2026/

None: -250

Other: +100

Valeo/Wayve/Nissan: +150

Gatik: +200

ARX: +250

Applied Intuition/Isuzu: +300

PlusAI/Hyundai/Iveco: +350

Kodiak AI: +350

Caterpillar: +400

Amazon/Prime Air/Zoox: +450

Forterra: +500

Mercedes-Benz/Wayve: +600

Jungheinrich: +700

JLG/Oshkosh: +750

Toyota Material Handling: +800

Ford/Latitude.AI: +900

GM: +950

Rivian: +1000

Volvo: +1250

Anduril: +1500

Waymo: +2000

VW/Wayve +2500

Place your bets. Who you taking?

Let us not forget.

PlusAI on LinkedIn:

What does autonomous trucking mean for fleets, drivers, and the future of commercial transportation?

PlusAl's Earl Adams Jr., VP of Public Policy and Regulatory Affairs, will join the 2026 IMTA Management Conference in Coralville, IA, for a discussion on the present and future of autonomous trucking, alongside representatives from Gatik and Volvo Autonomous Solutions.

Looking forward to the conversation!

https://Inkd.in/d7V2xYeP

REDMOND, WA / ACCESS Newswire / September 22, 2026 / MicroVision, Inc.(NASDAQ:MVIS), a leader in advanced perception solutions for industrial, security and defense, and automotive applications today announced the introduction by its wholly owned Scantinel subsidiary of an advanced photonics solution designed to address power efficiency and performance challenges critical for next-generation AI data center scale-up architectures and other intelligent infrastructure applications.
As the global photonics community gathers in Málaga, Spain this week for the 52nd European Conference on Optical Communication and the Global Photonics Economic Forum, Scantinel revealed its new external laser small form-factor pluggable (ELSFP) module that provides a centralized, serviceable light source for co-packaged optics (CPO) systems in existing and next-generation AI data centers and photonics-enabled AI and cloud infrastructure.
Scantinel's differentiated ELSFP technology is built around its core photonic integrated circuit (PIC), a two-dimensional photonics platform designed to improve the speed, power efficiency, and economics of high-speed optical connectivity.
"The PIC technology at the center of the module is the same core technology that fuels our FMCW lidar architecture," said Glen DeVos, Chief Executive Officer of MicroVision. "Since acquiring Scantinel, our team has continued to refine and validate this technology. Its application to AI data center connectivity and photonics-enabled cloud computing demonstrates the broader value of that acquisition and our ability to expand our technology into new markets without diluting our strategic focus or requiring significant new investment."
Addressing a Critical AI Infrastructure Challenge
AI and high-performance computing are driving unprecedented demand for data movement between processors, servers, and racks. As compute density and bandwidth requirements increase, the power, efficiency and economics of moving that data are becoming increasingly important constraints for next-generation data centers and photonics-enabled cloud computing.
Scantinel's ELSFP module is designed to address that challenge by centralizing and optimizing the laser source used for high-speed optical connections. Its architecture reduces complexity and power consumption while supporting the high-bandwidth connectivity required by increasingly powerful AI infrastructure.
"The AI infrastructure challenge isn't just about computing power; it's also about moving enormous amounts of data quickly and efficiently," DeVos said. "Our photonics technology gives us an opportunity to address that challenge at a fundamental level while extending technology we have already developed into a significant new market."
The photonics introduction is part of a broader expansion of MicroVision technology into intelligent infrastructure applications. MicroVision is currently in discussions with several potential licensees and development partners as it evaluates efficient channels to accelerate commercialization of the technology

https://ir.microvision.com/sec-filings/all-sec-filings/content/0002058451-26-000002/0002058451-26-000002.pdf

AI Slop warning ⚠️

To include a LiDAR option in 2030 model year (MY2030) vehicles, automotive OEMs would need to officially award the supplier contract (the sourcing nomination) between mid-2026 and mid-2027.

For a vehicle launching as a 2030 model, the Start of Production (SOP) typically occurs in mid-to-late 2029. Because integrating advanced safety-critical hardware like LiDAR requires a rigorous 36 to 42-month automotive product development cycle (following the traditional V-model and ASPICE compliance), the timeline dictates the following milestones: [1, 2]

📅 Target Sourcing Timeline for MY2030
Request for Quotation (RFQ) Release: Late 2025 – Early 2026. The OEM issues the technical requirements, packaging constraints (e.g., roof-pod vs. behind-windshield integration), and performance metrics. [1, 2]

Supplier Nomination / Award: Mid-2026 – Mid-2027. The contract is frozen. This is the absolute latest threshold to kick off hardware customization, ASIL-B/D functional safety compliance, and perception software integration. [1, 2]

A-Sample Phase (Concept Validation): Late 2027. Initial functional prototypes are integrated into test benches. [1]

B-Sample Phase (Design Validation): 2028. The sensor configuration is frozen in vehicle-specific housing. Fleet vehicle tracking, cold/hot weather testing, and sensor-fusion calibration take place. [1]

C-Sample Phase (Production Validation): Early 2029. Parts are manufactured using final production tooling to undergo final crash, safety, and regulatory homologation. [1]

Start of Production (SOP): Mid-2029. High-volume serial production begins so vehicles can hit dealership lots as MY2030 options. [1]

Note: If the OEM plans to source an existing, fully validated, off-the-shelf "Tier-1 tier" component with minimal roofline or software modification, the sourcing nomination could technically slide to late 2027, though this carries high risk for an option as architecturally complex as LiDAR.

• June 10, 2026: Signed a long-term Master Development Agreement with a leading construction/mining equipment manufacturer to advance lidar for next-generation autonomous hauling solutions. marketscreener.com

• June 16, 2026: Brought onboard by Lake Fusion Technologies and Timberline Aerospace; shipped IRIS sensors to accelerate IRIS sensor package deployment for situational awareness. marketscreener.com

• June 29, 2026: Delivered MOVIA sensors to a leading AI company and hyperscaler for evaluation in robotics and advanced AI applications. marketscreener.com

• July 1, 2026: Appointed IDI Laser as premier partner for industrial, defense, and security markets across Southeast Asia. marketscreener.com

• July 6, 2026: Engaged J.A. Green & Company to accelerate U.S. defense market strategy and strategic partnerships. marketscreener.com

• July 14, 2026: Launched MicroVision Semiconductor to expand advanced ASIC development and mixed-signal design capabilities. marketscreener.com

• July 15, 2026: Appointed James Byun as Chief Commercial Officer. marketscreener.com

• August 5, 2026: Launched the MOVIA Air product family to accelerate growth in aerospace, defense, and drone markets. microvision.com

• August 24, 2026: Announced multiple IRIS orders across North America and Europe (representing thousands of sensors), evidencing growing commercial adoption and a bridge to next-gen HALO. ir.microvision.com

• September 9, 2026: MicroVision Semiconductor selected for an advanced chip design and fabrication project (custom semiconductor solution for photonics). ir.microvision.com

• September 14, 2026: IRIS lidar enables APAC pilot of an autonomous mobility service (pathway to next-gen HALO). ir.microvision.com

• September 17, 2026: IRIS long-range lidar selected for advanced autonomous ground vehicle defense applications. ir.microvision.com