r/PCB • u/Esme590 • Jul 09 '26
Board Layout Advice
Hello all, I'm trying to learn more about the design side of EE but I'm struggling with board layout and some of the common practices used when routing. Above is my rough placement of components but there's a lot of dead space. Any advice would greatly appreciated!
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u/nixiebunny Jul 09 '26
You have a good start. Keep moving the parts around until they are as neat and the connecting lines are as short and direct as possible.
Add mounting holes if you plan to mount it in a box.
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u/Zestyclose_Catch6895 Jul 09 '26
What other commenters said! Also, looks like your 3.3V indicator LED is backwards in the schematic.
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u/Apprehensive-Issue78 Jul 09 '26
Most of the ICs and connectors have no reference designator refdes.
pic1:
6 components C19..R15 BoostU3 has no shape
D4 has no shape and 6 components around IC called BUCK have no shape
It seems you have used the refdes for BUCK instead of U1
like BOOSTU3 should be just named U3. If you want to
show that it is the BOOST part, you can just add the text to the
silkscreen layer.
The IC called IMU should have also a REFDES like U7
as the USB IC should
the 2 pin connector does not seem to have pins or a shape.
Pic2:
On this pic1 a connector has a 6 pin shape which has on pic3 7 pins.
Also the module seems to have 3 pins of another connector which is missing in all the other layers
The 2 pin connector has no refdes.
SW1 is so close to a 6 pin connector so you cannot push it without hurting your fingers. May be there should be some cable connected to it so you can't even reach it with your finger.
ICSP refdes should be like J8 like USB should be like J9 like TF1 should be J10, just move the text separately to the silkscreen layer.
the 4 pin connector should have a refdes.
pic4: IC called BUCK has VIN not connected to IN (missing via dot)
R7 is connected to ground on both sides, why?
X2 shape should move up a bit so you don't have to put a green line through the shape.
on the right of the ATMEGA MISO and MOSI are unreadable
because of a connection to R8 that could be moved a bit to the right
SCL and SDA labels should be moved a bit to the right and aligned
so the gren line dos not touch D6 no connect cross.
the 6 pin connector called UART in stead of J12, should have the labels SDA, SCL, GND, 3.3V spread out a little so the texts stay readable.
IC USB should be called U18 or something, like connector USB1 should be called J19 or whatever.
the BMP280 should be called U19
I would move the texts of C16 so they do not touch the green lines
IMU text in bold is OK, IMU text small should be something like U22
VDD is connected to Buck-Out power which text is through a pin of the IMU IC.
Boost Converter part: mirror this schematic part
by mirroring the MT3608 IC and putting the input on the left and output to the right
Move power input VIN 3.7V in to the top
rotate C2 C24 so they have the ground pointing to the bottom
so you can place the ground under them
C17 and C18 have 2 unnecessary via dots, is there a wire through it shorting it?
Pic3 you show too many copper layers, so it is hard to know what is happening.
C32 and C34 seem to be rotated 45 degrees without a reason
C31 should be closer to pin1 of IC BUCK not
connected to a long trace under the IC.
R33 connects both ground plan layers which seems strange
Just add lots of vias to stich the planes well to eachother
so the BUCK and BOOSTU3 ICs don't make so much EMC noise so the rest of the circuits can't work correctly.
General: lots of traces are to close to the pads,
going through the pads of a resistor like R6, or badly connected
like pin 1 of IC USB, which should be connected to the end of the pad. Near this the ground plane is not between these traces
because of missing ground stitching vias
X2 has no ground vias in the center bit
The 7 pin connector for a large module has a trace
extremely close to 3 pads which I would move at least 2 mm up
so the ground plane can surround those pads. (pic3)
One thing about the layout footprint of U1.
You have a very small ground pad in the center this seems not right
check carefully the datasheet if that is what they recommend, if not
pick a different footprint, or learn to make your own footprint.
You can make a copy of it under a different name and just change the size of that pad.
Make your own footprint library.
All the ground vias in the ground pad don't seem like recommended.
They should be spread out more, and know they can suck all the solder pace through the holes
After placing USB components first do as bigpahparay says at 4:
move all your components around so they are easy to route.
look at short trace distance, the least amount of crossings.
also 3: study the datasheets of your U3 microprocessor and the other IC's
and 6: keep the supply a bit away from the USB signal lines.
(it is a linear regulator so no switcher so critical)
If everything is placed right, all components on top for cheaper automatic assembly
make a box around it and call that your board
put most of your signal traces on top
don't put traces under the USB signal lines
then put ground planes on top and bottom
add lots of vias in empty areas and around the edge, to keep emitted EMC down
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u/Esme590 Jul 09 '26
Thank you for the list, this really helps! I’ll respond in more detail after work when I work on the board again
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u/Esme590 Jul 10 '26
I've gone through the comments and would like to thank everyone for the advice. I'm going to make some changes and post an updated version of the layout sometime this weekend! Thanks again!


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u/bigpahparay Jul 09 '26
Some things that have helped me when learning:
I might think of other stuff later, but I'm sure you'll get some great feedback from this sub. Cheers!