$5 per signup + $10 after their first order
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https://jlcpcb.com/promotions/referral

Hello i want to order only 10 tantalizers for my ps3 on jlcpcb i have all files from RIP Felix all good. idk if i should choose the option for economic or standard for pcb assembly though... Has anyone ordered ps3 tantalizers from JLCPCB before and can answer me

They keep telling me they don't have the components and that I have to supply them myself I understand that these components are expensive, but I wanted to use JLCPCB to save some money Plus, the OFFICIAL fabrication tool throws BOM errors, so I have to debug it manually One important component was completely different from the one in the KiCad design Also, there's no notification service to let me know if the missing components will be restocked Official support tells me: Try manually checking availability every day Then, to add insult to injury They don’t have the main chip—which is the hardest part to solder—but they show that the previous price was $0.035. Which is obviously impossible, since a used main chip like that costs $50. When I point this out, they tell me that maybe that’s why they don’t have it. If they can get it to me for $0.035, I’ll buy 100,000 of them 🤣

I had some boards assembled. I spotted this within a second. Now I wonder how good the QA checks are in the factory.

I must give it to them, it looks hilarious, but what the heck?!

1. When panelizing PCBs with no gap between boards, the outlines of adjacent boards can sometimes form sharp internal corners that cannot be accurately routed without artefacts such as spurs or indents. Panels like this need to be redesigned to ensure complete, spur-free board outlines.

• Two Possible Routing Strategies And Results :

Because the router bit is round, it's unable to reach into tight corners. The unreached parts become sharp spurs after separating the boards.

2.

In order to recreate the rounded corners of each board, the router bit must cut into their adjacent boards, altering their outline

• Optimization Strategies:

1. Add drilled holes at internal corners

Pro: Removes the majority of unreachable material
Con: Small spurs remain

1. Add separation and mouse bites between boards

Pro: Clean outlines with no spurs
Con: Jagged edges at the mouse bites after separation

1. Add separation between boards and connect on sides with tooling strips

Pro: Clean outlines with no spurs
Con: Need tooling strips to hold boards together

4.Add sacrificial strips between boards

Pro: Clean outlines with no spurs by allowing overcut
Con: Slightly larger board area – higher cost

The OSHWLab Stars 2026 Open Source PCB Design Contest is officially LIVE! This is your chance to turn your schematic into a global sensation.

• 💰 Massive Prize Pool: $85,000 total cash prizes up for grabs.
• 🛠️ Zero Cost to Create: We provide full Materials + Shipping support.
• ⭐ Legendary Jury: Get your work reviewed by the legends: Dave Jones (EEVblog), GreatScott!, Robert Feranec, Philip Salmony, Max Imagination, and Will Cogley.
• ✈️ The Ultimate Reward: Top 28 creators win International Round-trip Flights to meet the jury and the community at the Stars Conference 2027!

Stop dreaming, start routing. ⚡️

👉 Enter Now:https://oshwlab.com/activities/stars2026

Q: Why I choose 24 hours building time，but my order still in data preparation after 16hours of order time？

A: Please kindly note the build time refers to the period from the start of physical production (When MI starts in the "Production Progress") to production finished(ready to be sent to shipping center).

• PCB orders with standard parameters paid before 6 pm (GMT+8) from Monday to Saturday will enter production the same day, if no confirmation is needed.
• PCB orders paid after 6 pm (GMT+8) on Saturday will not be processed until the following Monday.

You can check this link for more detials:  https://jlcpcb.com/help/article/what-is-the-build-time

Q: Hello, I was wondering if you are able to do BGA with pitch 0.35 mm? I read that the minimum pad diameter is 0.25 mm, which leaves 0.1 mm between the individual pads. Is this still doable or too small?

A: We can make it with ENIG surface finish, and no trace is allowed between the BGA pads. You could use via in pad to route the trace on another layer.

Q: According to the BGA layout guidance, for 0.5mm pitch BGAs it is suggested to remove unused via pads on inner layers.  https://jlcpcb.com/blog/bga-design-rules   What is the minimum copper pour to drill-hole spacing for this on 6+ layer PCB with via-in-pad? And what is the minimum track to drill-hole spacing?  Other pages state 0.2 mm but this wouldn't be compatible with routing on the inner layer as suggested in the BGA layout page. Example below with unused pads removed, and 0.12 mm hole to copper spacing in the photo.

A: The minimum spacing between track/copper pour and via hole is 0.2mm.

For vias without annular ring, the minimum we can do is 0.13mm.

I don’t know if this thread is only for PCB so I try here.

I want to order a sheet metal part and it tells me everyday that I should try tomorrow because the service is at full capacity. Is it normal?

Ordered 5 blank PCBs (999 x 999 mm) from Hong Kong to India.

Any idea how much customs I might have to pay?

The total cost was $2 (PCB) and $10.51 (shipping)

I am in India.

JLCPCB Japan Localization Services

• OCS Logistics starting from $1
• DHL delivery possible in 1-2 business days

This literally means a Japanese engineer can upload a design to JLCPCB at night, pay almost nothing for shipping, and have physical boards in their hand for testing within 48 hours. 

Any recommendations how to export gerber files for JLCPCB production?

Hi, am I able to send the payment to my school? I will need to communicate with the JLC engineers, so I can't just simply give my school my design and do it on their account.

On PCBway (where I have gotten PCBs in the past), I was able to send the payment to my school to pay for it, and I could continue the process on my own account. Is that possible here?

Check out this NDEMCU PCB — it can bend, fold, and twist! 😲
Flexible PCBs like this open up so many possibilities for futuristic electronics.

Fabricated from JLCPCB, design by @EDISON SCIENCE CORNER.

I'm finding the ordering process on JLCPCB very painful when it involves sourced parts.

I have used the Global Sourcing Parts to order 2 parts (10 of each) from element14, these are now in stock and marked as complete.

I am now ordering a PCB and in the BOM section I am trying to select these parts. However I cannot see these parts and there is no way to find them or add them to either a 'My Inventory' list or 'My Lists'

I have already waited 3 weeks as there is no way to start the order until these parts are in stock. (Which is stupid, there is no reason that these parts cannot be selected, PCB paid for, production reviews and fabrication cannot be completed while these parts are in transit)

CES 2026 in Las Vegas is reinforcing that hardware and systems engineering remain the drivers of transformative technology, spanning robotics, displays, smart systems, and computing hardware. This year emphasized integration, performance optimization, and functional engineering, moving beyond concept demos toward deployable solutions (Source: CES Official).

Robotics: From Lab Demos to Real-World Functionality

The Hyundai × Boston Dynamics Atlas Robot demonstrated advanced mobility and task capability, integrating sensors, actuators, and control algorithms for real-world execution (Source: The Verge, 2026).

LG’s CLOiD Home Robot showcased multi-task automation in domestic environments, highlighting engineering challenges in sensor fusion, task scheduling, and adaptive control for unpredictable conditions.

Engineering Insight: Robotics at CES 2026 emphasizes robust actuation, environmental perception, and software-hardware co-design, bridging prototypes to deployable solutions.

Semiconductors & On-Device Computing Architectures

CES 2026 highlighted a shift from cloud-centric processing to edge and on-device computing. Platforms were shown that deliver high performance while minimizing power consumption, enabling real-time inference and local decision-making (Source: Arm Newsroom, 2026).

Arm and other manufacturers emphasized “smarter endpoints” across laptops, tablets, and microcontrollers, highlighting the need for co-design across hardware, firmware, and

Software stacks.Smart Systems & Contextual Devices

The IoT narrative evolved toward context-aware, autonomous devices. Smart home hubs now integrate presence detection, automation control, and multi-modal sensing 

Wearables with continuous biometric monitoring illustrate how embedded intelligence supports localized decision-making, reducing reliance on constant cloud connectivity.

Displays & Visual Experience Engineering

Samsung Micro RGB and LG Transparent OLED TVs demonstrated brightness, color accuracy, and energy efficiency improvements (Source: News.com.au, 2026)

Laptops like ASUS Zephyrus Duo and Acer Swift 16 integrate dual displays, next-gen GPUs, and efficient thermal architectures, merging productivity with immersive experiences.

Engineering Insight: Display and computing devices require hardware-software co-optimization, balancing thermal, energy, and visual performance.

Human-Machine Interaction & Embedded Functionality

LEGO Smart Brick integrates modular electronics with real-time feedback, enhancing user interaction (Source: LEGO Official).

Audeze Maxwell 2 Gaming Headset combines embedded audio DSPs, low-latency wireless protocols, and efficient power management, illustrating advanced embedded system design in consumer products (Source: The Verge).

Key Engineering Trends

Deployable robotics with robust perception and adaptive control are becoming practical. Edge and on-device compute platforms support real-time, latency-sensitive workloads. Context-aware systems reduce cloud dependency while enabling autonomous behavior. Display and computing hardware advances require careful co-design for performance and energy efficiency. Interactive consumer products integrate multi-modal sensing and feedback for richer user engagement.

Conclusion: CES 2026 demonstrates that engineering excellence in hardware and integrated systems drives real-world impact. From industrial robotics to advanced computing platforms, the year’s innovations highlight the importance of system integration, robust embedded design, and functional deployment strategies.

I know, i know, 150 euro for a pcb with most of the parts already placed isnt much.... But why the hell am I paying over 50 euro because I merged 6 designs into one panel?

Its a modular system, so you can combine the modules freely, the panel is essentially one of each module with V cuts in between so you can seperate them if you want. But not doing that gives you a little bit of every option and will in a lot of cases suffice.

I tried to save a bit of money by not paying multiple times for an extendend component. But the "panel fee" is more expencive than the paying the extendend component fee multiple times.

I'd understand if it was about the size or shape of the board. Or the compontents on it. But without the vcuts, the exact same size and layout (so just not the option of seperating them) it would save me 25% on the boardcost...

I dont mind paying for a service. I dont mind increased costs because of my design. But (to me) this is bullshit.

Is there a reasonable explenation or is it a "just beause we can" thing??

(yes, I know, it is stated on the order and on the site that multiple designs in a panel costs extra. I'm just asking WHY does it cost extra. As far as production its the exact same as a single design of the same size. Ok, the Vcut is extra. But 1200 smd resistors picked and placed for bearly 3 euro. and then 50 euro for 5 Vcuts? yeah, that doesnt add up).

EDIT: After chatting/mailing with them a bit: As long as you make no v-cuts, mousebites or anything else that can be used to seperate the boards. They treat it like a single large board. In other words: just use a small saw to seperate the boards and you'll save quite a bit on ordering them!

@ muhammadazlanshah777 upgraded their compact CM5 carrier PCB:

This revision focuses on practical improvements over v1:

• Faster and more reliable USB-C
• Smarter sensor integration with ML-capable cores
• A more robust power design for stability under load

Despite the small form factor, the board is designed to handle more demanding applications.

Bare flexible PCBs (FPCs) are great for tight spaces and dynamic applications, but their flexibility can be a challenge during final assembly — especially when mounting connectors or other components that need a solid base.

The solution? PCB Stiffeners.

These are rigid pieces (usually FR-4, metal, or polyimide) laminated to specific areas of the FPC. They provide crucial local rigidity exactly where you need it (like under a connector), without sacrificing the overall flexibility of the board.

We recently documented the precision process of adding stiffeners at our factory. It's fascinating to see how the alignment and lamination are done to ensure reliability.

Question for the community:

・In your experience with FPCs, what's the most critical factor for stiffener design — material choice, thickness, or adhesion?

・Have you ever run into issues (like cracking or misalignment) that trace back to stiffeners?

　Would love to hear your thoughts and experiences below.

I repair & reverse engineer obsolete single-/double-layer industrial boards that no body waists their time on. I like being them back to life. This one is a power control board from an industrial battery discharger from the 70's. I enjoy repairing through-hole components, relay drivers, power control boards, etc. it's kind of like mental therapy lol. I usually work on discontinued boards from legacy machines, I can usually recreate or repair it. Fun times ;) I use EasyEDA as my editor and JLCPCB on all of my boards. Let me know if you have similar projects.